JRC/NJR Semiconductor Products on ICGOODFIND SiteMap
最新文章
- KYOCERA AVX Tantalum Capacitor Guide | Prefix Meaning, Key Parameters & Popular Models
- Nearfield Instruments Raises $380M Series D – Largest Dutch Deep‑Tech Round Ever
- Nations Technologies Surges 20% on CPO MCU Roadmap for AI Optical Interconnects
- ICGOODFIND: Electronic Component & IC Purchasing Guide | Essential Skills & Practical Tips for Beginners
- WinCO Nova 1000mW Single‑Mode 980nm Pump Laser Chip Breaks Global Monopoly
- ICgoodFIND 2026 Duanwu Festival Holiday Notice
- Bourns Popular Components Overview | Reference Guide for Engineers: Trimmers & Circuit Protection Devices
- Nokia Expands Pennsylvania Photonics Plant to Power AI Interconnect, Adds 250 Jobs
- Qualcomm in Talks to Acquire AI Chip Startup Tenstorrent for Up to $10 Billion
- Nvidia Pitches Vera CPU to China Clients: 88‑Core Arm Chip Launching August 2026
- SK Hynix to Triple Wafer Capacity by 2034, Picks Japan for First Overseas Fab
- Moore Threads Open‑Sources MusaCoder: LLM for GPU Kernel Generation, Trained Entirely on Domestic GPUs
- Samsung Plans New Advanced Packaging Plant in Gwangju to Boost HBM and AI Chip Capacity
- JCET Launches 3D Power Module Packaging Solution for AI Data Centers
- Nvidia’s New Vera CPU Picks SK Hynix DRAM as Memory Supplier
- TI DSP Chip Overview: Features & Typical Applications of Popular TMS320 Series Models
- SK Group Halts SK Siltron Sale at Final Stage, Citing Supercycle and AI Strategy
- Geehy Launches Three G32A Auto MCUs – Mass Production for Body, Lighting, Thermal Management
- Guide to VISHAY Component Naming Rules & Practical Device Selection
Preface
- STMicro and Arm Raise Forecasts on AI Infrastructure Boom – ST Sees $1B Data Center Revenue in 2026
- NXP PMEG3020DEP: A Comprehensive Technical Overview of its Characteristics and Circuit Design Applications
- NXP PMF280UN,115: A Comprehensive Technical Overview of its Features and Applications
- NXP PMF280UN: A Comprehensive Technical Overview of its Features and Target Applications
- NXP PMST2222: A Comprehensive Technical Overview of the PNP Switching Transistor
- NXP PMPB215ENEA: A Comprehensive Technical Overview of the High-Performance Power Management IC
- NXP PMEG6010EP,115: A High-Performance Schottky Barrier Diode for Advanced Power Efficiency
- NXP PMEG3010BER: A Comprehensive Technical Overview of the 30V, 1A Schottky Barrier Diode
- NXP PMEG2015EA: A Comprehensive Technical Overview of the 20V, 5A Low VF Schottky Barrier Diode
- Nuvoton NAU8421YG: 24‑Bit Stereo DAC with 128dB SNR, –99dB THD+N
- Marvell Q1 Revenue Hits Record $2.418B, Net Income Falls 81% on Acquisition Costs
- NXP TJA1022T: A Comprehensive Technical Overview of LIN Bus Transceiver Solutions
- NXP TEF6621T/V1: A Comprehensive Technical Overview of its Tuner and Receiver Architecture
- NXP PBSS4540X: A Comprehensive Technical Overview of the 40V, 4A NPN Transistor
- NXP NXQ1TXH5/101: The Next-Generation Secure Element for Advanced Automotive and IoT Applications
- NXP BT151-1000RT: A Comprehensive Technical Overview of the 12A Standard Thyristor
- NXP BZX585-B12: A Comprehensive Guide to Its Features and Applications
- NXP BCP53-10: A Comprehensive Technical Overview of the High-Voltage NPN Digital Transistor
- NXP MKL27Z256VLH4: A Comprehensive Technical Overview of the Ultra-Low-Power ARM Cortex-M0+ Microcontroller
- Huawei Kirin Chip Breaks 3GHz with Logic Folding, Unveils Tao Law at ISCAS 2026
- Alibaba Cloud Unveils Zhenwu M890 AI Chip and 128‑Card Supernode Server
- AMD’s Su Meets China VP He Lifeng, Pledges More Investment and Compute Partnership
- ChangXin Memory Q1 Profit Hits 4.6 B , R e v e n u e S u r g e s 719 4.6B,RevenueSurges7197.1B
- NXP BFR30: A Comprehensive Technical Overview of the Low-Noise Silicon RF Transistor
- The NXP BLF6G20LS-110 is a high-performance N-channel enhancement-mode lateral MOSFET (LDMOS) transistor engineered for high-power, high-gain applications within the 0 GHz to 7 GHz frequency range. Th
- HuaHong Q1 Profit Soars 458% to $20.9M, 12-Inch Revenue Hits 62.7%
- NXP BGA3012: A 50 MHz to 4000 MHz Broadband SiGe HBT Low-Noise Amplifier MMIC
- NXP BYV29FD-600: A Comprehensive Technical Overview of its Ultrafast Recovery Diode Characteristics and Applications
- The NXP BLF647 is a high-power, N-channel enhancement-mode lateral MOSFET (LDMOS) transistor designed for demanding RF applications. It is engineered to operate in the 8 – 470 MHz frequency range, mak
- NXP BSP122: A Comprehensive Overview of the High-Performance Bipolar Switch IC
- NXP BGS8324: A Comprehensive Overview of the High-Performance SPDT RF Switch
- NXP BZB84-B16: A Comprehensive Technical Overview of the 16V Zener Diode Series
- AMD Quietly Takes Stake in Marvell as Nvidia Commits $2B to Strategic Partnership
- US Pressures Tesla to Move AI6.5 Chip Orders from TSMC to Intel
- NXP TJA1145AT/FD: A Comprehensive Overview of its High-Speed CAN FD Transceiver Features and Applications
- NXP S912ZVL64F0MLF: A Comprehensive Technical Overview of the 32-bit Automotive Microcontroller
- NXP LS1012ASN7KKB: A High-Performance Networking Processor for Advanced Embedded Applications
- NXP MK22FN512VLL12R: A Comprehensive Technical Overview of the Kinetis K22 Microcontroller
- NXP MPC555LFAVR40 Microcontroller: Architecture, Features, and Target Applications
- NXP LS1043AXE8MQB: A High-Performance Quad-Core Processor for Advanced Networking and Embedded Applications
- PCF85163T: NXP's Ultra-Low Power Real-Time Clock for Extended Battery Life Applications
- NXP FX32K144HAT0MLHT: A Comprehensive Technical Overview of the 32-bit Automotive Microcontroller
- TSMC Arizona’s Third Fab Tops Out, Set for 2nm Production
- Arrow Electronics Q1 Revenue Jumps 39% to $9.47B, Beats Wall Street Estimates
- Astera Labs Unveils 320‑Lane PCIe Switch – Industry’s Largest
- Lattice Buys Firmware Giant AMI for $1.65B – Aiming at AI Data Centers
- NXP TEF6686HN: A Comprehensive High-Performance Single-Chip Car Radio Solution
- Unveiling the NXP LPC844M201JHI33: A Comprehensive Guide to its Architecture and Applications
- NXP BCM62B: A Comprehensive Overview of Its Architecture and Application in Modern Secure Systems
- MCIMX6Q5EYM10ADR: NXP's i.MX 6Quad Processor for High-Performance Embedded Applications
- NXP TEF6638HW: The High-Performance Automotive Radio DSP SoC
- Dual 4-Bit Binary Ripple Counter IC: A Comprehensive Datasheet Overview of the NXP 74HC393PW
- NXP ASL5115SHNZ: A Comprehensive Technical Overview of its Features and Applications
- NXP BCM847DS: A High-Performance Dual-Port Gigabit Ethernet PHY for Demanding Network Infrastructure
- GalaxyCore Ships 1.1B CMOS Sensors – Revenue Up 22% But Profit Crashes 73%
- CRM IC’s 2025 Revenue Tops $1.5B – High‑End MEMS Microphone Breakthrough
- Microchip TCM809MENB713 Reset Circuit Supervisor: Features and Application Design Guide
- Microchip dsPIC33FJ16GS502T-I/MM: A High-Performance Digital Signal Controller for Advanced Power Conversion and Digital Power Supply Applications
- MCP1700T-2502E/MB 250mA Low-Dropout Voltage Regulator (LDO) from Microchip
- Microchip PIC16C620A-04/SO 8-Bit OTP Microcontroller
- High-Performance Power Management with the Microchip UCS81003AMR-C1A Synchronous Buck Controller
- Microchip EMC1414-1-AIZL-TR High-Accuracy, Four-Channel Temperature Sensor
- Microchip LR645N3-G: Advanced Power Management IC for High-Efficiency Applications
- Microchip PIC18F6410-I/PT: A Comprehensive Technical Overview
- Google Teams With Marvell to Build Two New AI Chips – MPU & Next-Gen TPU
- Chinese Auto Radio Chip QX300 Hits 1M Shipments – Ends Foreign Monopoly
- Chinese Auto Radio Chip QX300 Hits 1M Shipments – Ends Foreign Monopoly
- Tesla’s 2nm AI5 Chip Tapes Out – Musk Hints at Record Volume Production
- Sony Gets $380M Japan Subsidy for Kumamoto Image Sensor Fab
- TSMC Q1 Profit Expected to Jump 50% – AI Demand Drives Record Streak
- Zhejiang Jingci Semiconductor Enters Bankruptcy, Warning for China’s Ceramic Substrate Industry
- Nanya Q1 Profit Soars 14x as DRAM Prices Jump 70%
- NIO’s Self-Developed Chips Surpass 550K Shipments, Save $300M Annually
- Complete Guide to Electronic Component Letter Symbols (Detailed Explanation by ICGOODFIND)
- HWATSING’s Versatile-GH300: First 12-Inch Wafer Thinning Tool for Advanced Memory
- Intel Joins Musk’s TeraFab – 1 Terawatt AI Fab Coming
- ICGOODFIND Talks About China's Automotive Chip Market Sales Ranking in March 2026
- Intel Buys Back 49% of Fab 34 for $14.2 Billion
- Apple Reportedly Plans to Use YMTC Flash Memory for China iPhones
- Semiconductor High Growth: Hidden Risks and Structural Differences
- China’s Largest DRAM Maker Turns Profitable